Identity, Security, Payments, Biometrics, Smart Cards and Authentication News

Intel and Infineon Technologies work on HD SIM card

Wednesday, November 14, 2007

Intel and Infineon Technologies are planning to start sampling high-density SIM card sometime next year with production slated for 2009. Infineon’s HD security microcontroller will be integrated with Intel’s NOR flash memory technology ranging from 4MB to 64MB. As part of the venture, Infineon will develop a 32-bit security microcontroller based on its existing SLE 88 family for use with HD SIM cards. By late 2008, the new USB interface of SIM cards will enable additional data-intensive mobile applications, services and over-the-air downloads.

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Infineon Technologies has released a high-speed open interface for the company’s NFC security microcontrollers (eSE).

The DCLB (Digital Contact Less Bridge) interface is an open solution that connects the eSE and the NFC modem for faster data transfer rates. According to Infineon, this is achieved by dispensing with the temporary storage of data packets in the NFC modem, allowing the data to be transferred directly from the terminal to the Secure Element without creating additional protocol overheads.

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The NFC Forum has announced that Intel Corporation has upgraded its membership from Principal to Sponsor, the highest level of membership in the organization.

As a Sponsor member, Intel will hold a seat on the NFC Forum Board of Directors, as well designate individuals to run for Forum leadership positions and appoint one voting representative to all NFC Forum Committees and Working Groups.

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Just weeks after joining the NFC Forum’s board of directors, Intel has revealed that its new “Ivy Bridge” Core-brand processor will feature built-in support for NFC payments, reports Laptop Magazine.

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Infineon Technologies has announced the availability of world’s first security chip solutions compliant to the open standard CIPURSE for public transport applications.

Infineon’s CIPURSE security chip and NFC Secure Element can now be used by public transport companies to issue interoperable contactless tickets, cards and mobile applications for fare payments. Infineon says these will be the first of several CIPURSE compliant products slated for release in the near future.

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Infineon Technologies has released the first samples of its 65 nanometer embedded flash (eFlash) microcontrollers for chip card and security applications.

Co-developed by TSMC, the microcontroller features a 65 nm footprint that provides greater efficiency over former IC technologies, according to Infineon. The partners have also announced the development of new 300 mm wafers as a more efficient alternative to 200 mm models.

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Intel Corp. has signed a deal with Inside Secure that will enable Intel’s Mobile Wireless Group to develop new NFC-enabled solutions based on Inside’s MicroRead, SecuRead and Open NFC products.

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