Identity, Security, Payments, Biometrics, Smart Cards and Authentication News

INSIDE debuts new chips

Monday, March 10, 2008

INSIDE Contactless announced a new micrprocessor platform designed to bring new contactless applications to mainstream markets in the U.S. and elsewhere. The two two initial product offerings are intended for contactless payment applications. The MicroPass 4000 product suite is designed to add applications beyond payments to a range of applications, including transit fare systems, access control, loyalty programs, as well as a lightweight identification applications.

The INSIDE MicroPass 4000 product suite has been built upon the MicroPass L4-1G and L4-2G products, which have been utilized by more than 25 issuers to deploy more than 35 million cards in 2006 and 2007. The MicroPass 4000 payment platform was designed to meet the multi-payment brand and multi-application requirements of the U.S., Canadian and other contactless payment markets.


The MicroPass 4002 supports the Discover Zip contactless payment application, while the dual-brand MicroPass 4003 supports both MasterCard and Visa contactless payment applications. Flexible packaging options enable manufacturers to purchase MicroPass 4000 solutions in multiple configurations, including wafer, module, and inlay forms for use in card, fob, mobile handset, sticker, and ticket form factors.

The MicroPass 4000 product suite shares a common architecture featuring a fast, low-power RISC microprocessor, operating system, optimized hardware computing resources, and data management support capabilities. Each product is configured to for specific mass market applications such as contactless payments, retail/gift cards, access control, transit, ID, or other emerging uses. Designed to be embedded in plastic credit and debit cards – in standard, mini, and fob form factors – so that a wave of the card is all that it takes to make a payment.

The INSIDE Contactless MicroPass 4002 and MicroPass 4003 products are available now in production quantities. [end] 

Gaming Partners International announced that it has received three orders to supply casino chips and plaques totaling just under $4.7 million.

The company will produce approximately 700,000 custom Bourgogne et Grasset (B&G) premium casino chips for Venetian Macau Limited’s Sands Macau and Sands Cotai properties. GPI will also produce over 80,000 B&G RFID plaques to Sociedade de Jogos de Macau, S.A. (SJM)’s Grand Lisboa property.

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Samsung and Visa are providing their sponsored athletes and trialists at the London 2012 Olympic Games with special edition Samsung Galaxy S III handsets equipped with Visa’s payWave NFC payments application.

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Calgary, Alberta is pushing forward with the anticipated summer launch of a new smart card payment system for public transit, according to the Calgary Herald.

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Samsung Electronics has unveiled its third generation NFC-enabled Galaxy S handset, the Galaxy S III.

Powered by Android 4.0 Ice Cream Sandwich, the Galaxy S III features a 4.8 inch HD Super AMOLED display, 8MP camera, 1.4 Ghz quad-core chip and 16 GB of internal memory. The device also features an NFC chip for making mobile payments and peer-to-peer data transfers via “S Beam,” a supped up version of Android Beam.

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Cubic Transportation Systems has introduced Nextaccount, an account-based open payment platform that offers travelers the convenience to use contactless bank cards, student IDs and mobile phones as their smart ticket, in addition to transit issued smart cards.

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PATCO, the high speed rail line that runs between Philadelphia and Camden County, N.J., is preparing to shift into Phase Two of its open payment trial.

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